Apple 165c Spezifikationen PDF herunterladen (Seite 91)

Take Apart Daughterboard - 32

Using the Apple logic

board take-apart tool,

disconnect the

daughterboard from the

motherboard.

Replacement Note:

The

green heat sinks attached to

the daughterboard are made

of delicate heat-conducting

material. If they are missing

or damaged, they must be

replaced.

Replacement Note:

To

replace a damaged heat sink,

carefully peel it from the

daughterboard. Select the

Heat Sinks

Daughterboard

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